Published date: 9 January 2020

Awarded contract - This means that the contract has been awarded to a supplier.


Closing: 30 September 2019

Contract summary

Industry

  • Electronic equipment - 31710000

  • Laboratory, optical and precision equipments (excl. glasses) - 38000000

Location of contract

Any region

Value of contract

£55,000 to £70,000

Procurement reference

ITC- 2019-028

Published date

9 January 2020

Closing date

30 September 2019

Contract start date

4 October 2019

Contract end date

3 October 2022

Contract type

Supply contract

Procedure type

Open procedure (below threshold)

Any interested supplier may submit a tender in response to an opportunity notice.

This procedure can be used for procurements below the relevant contract value threshold.

Contract is suitable for SMEs?

Yes

Contract is suitable for VCSEs?

No

Description

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.

As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.

The bond test system shall allow the CSA Catapult to perform in-house measurements of die bonded (bonding of a chip to a substrate using a variety of attachment techniques) and wire bonded (mechanically attached wires to connect the chip and substrate) prototype samples. The equipment is intended to provide results of the bonded interface as the quality of the bond is an indicator of the overall mechanical quality of a part. The system shall also be capable of testing for adhesion strength, stress and strain capability of new materials over a range of low to high temperature applications. This will be used for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions involving introduction of novel material properties.

The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.

The Catapult may also purchase additional, related services.

More information

Previous notice about this procurement

Bond Tester

  • Opportunity
  • Published 17 September 2019

Additional text

To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-028 in the subject field.

Award information

Awarded date

21 October 2019

Contract start date

22 October 2019

Contract end date

3 October 2022

Total value of contract

£69,950

This contract was awarded to 1 supplier.

INSETO (UK) LIMITED

Address

Unit 25 Focus 303 Business Centre Focus Way
Andover
Hampshire
SP10 5NY
GB

Reference

Companies House number: 02096377

Supplier is SME?

Yes

Supplier is VCSE?

No

About the buyer

Address

CSA Catapult Innovation Centre
Celtic Way, Imperial Park
Newport
NP10 8BE
Wales

Email

procurement@csa.catapult.org.uk

Website

https://csa.catapult.org.uk