Published date: 17 September 2019
This notice was replaced on 9 January 2020
This notice does not contain the most up-to-date information about this procurement. The most recent notice is:
Awarded contract (published 9 January 2020)
Closed opportunity - This means that the contract is currently closed. The buying department may be considering suppliers that have already applied, or no suitable offers were made.
Contract summary
Industry
Electronic equipment - 31710000
Laboratory, optical and precision equipments (excl. glasses) - 38000000
Location of contract
Any region
Value of contract
£55,000 to £70,000
Procurement reference
ITC- 2019-028
Published date
17 September 2019
Closing date
30 September 2019
Contract start date
4 October 2019
Contract end date
3 October 2022
Contract type
Supply contract
Procedure type
Open procedure (below threshold)
Any interested supplier may submit a tender in response to an opportunity notice.
This procedure can be used for procurements below the relevant contract value threshold.
Contract is suitable for SMEs?
Yes
Contract is suitable for VCSEs?
No
Description
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bond test system shall allow the CSA Catapult to perform in-house measurements of die bonded (bonding of a chip to a substrate using a variety of attachment techniques) and wire bonded (mechanically attached wires to connect the chip and substrate) prototype samples. The equipment is intended to provide results of the bonded interface as the quality of the bond is an indicator of the overall mechanical quality of a part. The system shall also be capable of testing for adhesion strength, stress and strain capability of new materials over a range of low to high temperature applications. This will be used for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions involving introduction of novel material properties.
The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.
The Catapult may also purchase additional, related services.
More information
Additional text
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To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-028 in the subject field.
About the buyer
Address
CSA Catapult Innovation Centre
Celtic Way, Imperial Park
Newport
NP10 8BE
Wales
procurement@csa.catapult.org.uk
Website
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