Published date: 26 July 2019

Last edited date: 26 July 2019

Awarded contract - This means that the contract has been awarded to a supplier.


Closing: 7 May 2019

Contract summary

Industry

  • Laboratory, optical and precision equipments (excl. glasses) - 38000000

Location of contract

Any region

Value of contract

£120,000 to £180,000

Procurement reference

ICT-2019-027

Published date

26 July 2019

Closing date

7 May 2019

Contract start date

24 May 2019

Contract end date

23 May 2022

Contract type

Supply contract

Procedure type

Open procedure (above threshold)

Any interested supplier may submit a tender in response to an opportunity notice.

This procedure can be used for procurements above the relevant contract value threshold.

Contract is suitable for SMEs?

Yes

Contract is suitable for VCSEs?

No


Description

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions.
The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.

The Catapult may also purchase additional, related services.


More information

Previous notice about this procurement

Die Bonder

  • Opportunity
  • Published 5 April 2019

Additional text

To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-027 in the subject field.


Award information

Awarded date

19 June 2019

Contract start date

20 June 2019

Contract end date

19 June 2022

Total value of contract

£146,000

This contract was awarded to 1 supplier.

INSETO (UK) LIMITED

Address

Unit 25 Focus 303 Business Centre Focus Way
Andover
Hampshire
SP10 5NY
GB

Reference

Companies House number: 02096377

Value of contract

£0

Supplier is SME?

Yes

Supplier is VCSE?

No


About the buyer

Address

Regus Falcon Drive
Cardiff Bay
Cardiff
CF10 4RU
Wales

Email

procurement@csa.catapult.org.uk

Website

https://csa.catapult.org.uk