Published date: 5 April 2019
This notice was replaced on 26 July 2019
This notice does not contain the most up-to-date information about this procurement. The most recent notice is:
Awarded contract (published 26 July 2019, last edited 26 July 2019)
Closed opportunity - This means that the contract is currently closed. The buying department may be considering suppliers that have already applied, or no suitable offers were made.
Contract summary
Industry
Laboratory, optical and precision equipments (excl. glasses) - 38000000
Location of contract
Any region
Value of contract
£120,000 to £180,000
Procurement reference
ICT-2019-027
Published date
5 April 2019
Closing date
7 May 2019
Contract start date
24 May 2019
Contract end date
23 May 2022
Contract type
Supply contract
Procedure type
Open procedure (above threshold)
Any interested supplier may submit a tender in response to an opportunity notice.
This procedure can be used for procurements above the relevant contract value threshold.
Contract is suitable for SMEs?
Yes
Contract is suitable for VCSEs?
No
Description
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build. It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions.
The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.
The Catapult may also purchase additional, related services.
More information
Additional text
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To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-027 in the subject field.
About the buyer
Address
Regus Falcon Drive
Cardiff Bay
Cardiff
CF10 4RU
Wales
procurement@csa.catapult.org.uk
Website
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