Published date: 7 January 2020

Awarded contract - This means that the contract has been awarded to a supplier.


Closing: 8 November 2019

Contract summary

Industry

  • Microelectronic machinery and apparatus - 31712100

Location of contract

OX11 0QX

Value of contract

£500,000 to £1,000,000

Procurement reference

UK SBS PR19072/A

Published date

7 January 2020

Closing date

8 November 2019

Contract start date

17 December 2019

Contract end date

31 July 2020

Contract type

Supply contract

Procedure type

Open procedure (above threshold)

Any interested supplier may submit a tender in response to an opportunity notice.

This procedure can be used for procurements above the relevant contract value threshold.

Contract is suitable for SMEs?

Yes

Contract is suitable for VCSEs?

No

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) develop detectors to cover a broad range of scientific measurement in the X-Ray, infrared, visible light, neutron, gamma ray parts of the EM spectrum. UKRI-STFC require a flip chip bonder which will perform the assembly of such a range of radiation sensitive detectors. The detectors generally consist of a 2D array of complementary metal oxide semiconductor (CMOS) readout integrated circuit (ROIC), bonded to a geometrically similar 2D array of solid-state sensor material to form a hybrid pixel sensor. In many cases, the ROIC is silicon, but often the sensor is selected to provide specific detection properties for the radiation range being sensed. This means that a wide variety of sensor materials are possible, including but not limited to silicon, germanium, cadmium telluride, cadmium zinc telluride, gallium arsenide and gallium antimonide.

Most of the projects are small volume (1-5 units), high value runs, but it is also required to perform higher volume assemblies of a few 10s, 100s or potentially 2000-3000 units. Small volume runs must be accommodated by creating breaks during larger runs, necessitating rapid turn reconfigurations.

The assembly facility is currently going through a major upgrade and will be moving into new custom built premises and looking to build on that improvement by enhancing the bonding and assembly capabilities. Floor space has been allocated with service provision installed for a typical flip chip bonder.

UKRI-STFC has an established flip chip and die placement capability which utilises a range of bond processes but there is a recognised need to future proof the assembly infrastructure, increase the capacity and provide for making process enhancements to enable assembling higher numbers of more densely packed pixels. There are also plans to extend the range of processes which can be supported in the future, giving the ability to offer more than the current core flip chip processes.

Please refer to the specification for the full requirement.

More information

Previous notice about this procurement

UK SBS PR19072 Flip Chip Aligner

  • Opportunity
  • Published 4 October 2019

Links

Additional text

Please Note: Do not apply directly to the Buyer. Please disregard any content in this notice that requests your organisation "to apply directly to the buyer" as this unfortunately a system generated error, that is outside of the Contracting Authorities control.The final date and time for the submission of bids is 08/11/2019 at 1100hrs GMT.

All submissions will be assessed in accordance with the Public Contracts Regulations 2015, for procurement values that exceed Regulation 5 (Threshold amounts).

The contracting authority shall utilise the Delta eSourcing Procurement Tool available at https://uksbs.delta-esourcing.com/ to conduct this procurement. All enquiries with respect to problems or functionality within the tool may be submitted to Delta eSourcing on 0845 270 7050. Please utilise the messaging system within the e-sourcing tool at the above link. Please note this is a free self-registration website and this can be done by completing the online questionnaire at https://uksbs.delta-esourcing.com/

Award information

Awarded date

20 December 2019

Contract start date

2 January 2020

Contract end date

31 July 2020

Total value of contract

£899,801.47

This contract was awarded to 1 supplier.

SET Corporation SA

Address

131 Impasse Barteudet, Saint-Jeoire, 74490, France

Reference

No reference - other

Value of contract

£899,801.47

Supplier is SME?

Yes

Supplier is VCSE?

No

About the buyer

Contact name

Alistair Staunton-Lambert

Address

North Star House
SWINDON
SN21FF
England

Email

majorprojects@uksbs.co.uk