Published date: 5 January 2024

Awarded contract - This means that the contract has been awarded to a supplier.


Closing: 20 December 2023, 12am

Contract summary

Industry

  • Indium - 14763000

Location of contract

South East

Value of contract

£185,067

Procurement reference

BIP833356262

Published date

5 January 2024

Closing date

20 December 2023

Closing time

12am

Contract start date

2 January 2024

Contract end date

1 January 2025

Contract type

Supply contract

Procedure type

Open procedure

Any interested supplier may submit a tender in response to an opportunity notice.

Contract is suitable for SMEs?

Yes

Contract is suitable for VCSEs?

No

Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

More information

Links

Award information

Awarded date

20 December 2023

Contract start date

2 January 2024

Contract end date

1 January 2025

Total value of contract

£185,067

This contract was awarded to 1 supplier.

HHV Ltd

Address

Unit 14 Lloyds Court
Crawley
RH10 9QX

Reference

None

Supplier is SME?

Yes

About the buyer

Address

https://www.ukri.org
North Star Avenue
Swindon
SN2 1FL
UK

Telephone

+441793442000

Email

commercial@ukri.org