Published date: 17 August 2021
This notice was replaced on 21 April 2022
This notice does not contain the most up-to-date information about this procurement. The most recent notice is:
Awarded contract (published 21 April 2022)
Closed opportunity - This means that the contract is currently closed. The buying department may be considering suppliers that have already applied, or no suitable offers were made.
Contract summary
Industry
Laboratory, optical and precision equipments (excl. glasses) - 38000000
Location of contract
Wales
Value of contract
£250,000 to £350,000
Procurement reference
ITC-2021-053
Published date
17 August 2021
Closing date
31 August 2021
Closing time
10am
Contract start date
20 September 2021
Contract end date
19 September 2025
Contract type
Supply contract
Procedure type
Open procedure (above threshold)
Any interested supplier may submit a tender in response to an opportunity notice.
This procedure can be used for procurements above the relevant contract value threshold.
This is an accelerated procedure.
Justification
A shorter tender response period is not practical on this occasion.
Contract is suitable for SMEs?
Yes
Contract is suitable for VCSEs?
No
Description
Scope
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes.
As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and preferably 90-degree cut. This system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications.
The machine shall be able to achieve full-cut dicing. It will be needed to integrate in the machine tape removal after dicing process completion. The machine shall have a visual monitoring system for inspection during dicing and drilling. The machine should handle wide ranges of material thickness 100 micron to 1.5 mm (preferably higher if applicable) and work with high drilling aspect ratios (material thickness /drill diameter) as high as 40:1 with high-quality edge finish and minimum taper angle (preferably 90-degree cut).
The system shall provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth. This should help in extending machine capabilities to include applications such as resistance laser trimming.
System Outline
The system is expected to be composed of a Class 1 laser drilling and dicing chassis with an integrated air-cooling unit, including several options to handle diverse material types and thicknesses and a wide range of drilling aspect ratios using a laser source. The system shall include auxiliaries such as vision inspection, fume extractor systems, and a viewing window to be able to check when laser is on or off, during operation. The machine software should be user friendly and enable a wide range of users with different skill levels to utilize the machine. The machine should have a precise power meter to control the laser source power. Safety features such as a handheld barcode reader/scanner should be incorporated.
A system solution is required that is flexible and upgradable in the future.
More information
Additional text
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The estimated value of the contract is £250,000 to £350,000 including goods to meet the requirements, user software, installation, training, options and extensions.
The system will must be invoiced before the end of December 2021 delivered in January 2022.
To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2021-053 in the subject field.
About the buyer
Address
CSA Catapult Innovation Centre
Celtic Way Imperial Park
Newport
NP10 8BE
Wales
procurement@csa.catapult.org.uk
Website
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