Published date: 26 July 2019
Last edited date: 26 July 2019
Awarded contract - This means that the contract has been awarded to a supplier.
Contract summary
Industry
Laboratory, optical and precision equipments (excl. glasses) - 38000000
Location of contract
Any region
Value of contract
£150,000 to £180,000
Procurement reference
ITC-2019-026
Published date
26 July 2019
Closing date
7 May 2019
Contract start date
24 May 2019
Contract end date
23 May 2022
Contract type
Supply contract
Procedure type
Open procedure (above threshold)
Any interested supplier may submit a tender in response to an opportunity notice.
This procedure can be used for procurements above the relevant contract value threshold.
Contract is suitable for SMEs?
Yes
Contract is suitable for VCSEs?
No
Description
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform wire bonding from chips and modules on to substrates and PCB boards.
The wire bonding equipment shall allow manual and automated bonding for experimentation and low volume prototype volume build. It shall be adaptable to wire bond a wide variety of components from chip level through to module level using organic- inorganics substrates and PCBs for all required package architecture required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions.
The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.
The Catapult may also purchase additional, related services.
More information
Previous notice about this procurement
Automated Multipurpose Wire Bonder
- Opportunity
- Published 5 April 2019
Additional text
-
To express interest in this opportunity and receive the tender documents, please email procurement@csa.catapult.org.uk with ITC-2019-026 in the subject field.
Award information
Awarded date
26 June 2019
Contract start date
27 June 2019
Contract end date
25 June 2022
Total value of contract
£169,000
This contract was awarded to 1 supplier.
ACCELONIX LIMITED
Address
Unit 2, Mcclintock Building
CAMBRIDGE
Cambridgeshire
CB21 6GP
GBReference
Companies House number: 03633364
Value of contract
£0
Supplier is SME?
Yes
Supplier is VCSE?
No
About the buyer
Address
Regus Falcon Drive
Cardiff Bay
Cardiff
CF10 4RU
Wales
procurement@csa.catapult.org.uk
Website
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Closing: 7 May 2019
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