Published date: 12 November 2020
Closed opportunity - This means that the contract is currently closed. The buying department may be considering suppliers that have already applied, or no suitable offers were made.
Contract summary
Industry
Electrical equipment and apparatus - 31600000
Laboratory, optical and precision equipments (excl. glasses) - 38000000
Location of contract
Wales
Value of contract
£60,000 to £80,000
Procurement reference
ICT-2020-043
Published date
12 November 2020
Closing date
3 December 2020
Closing time
12pm
Contract start date
8 January 2021
Contract end date
7 January 2024
Contract type
Supply contract
Procedure type
Open procedure (below threshold)
Any interested supplier may submit a tender in response to an opportunity notice.
This procedure can be used for procurements below the relevant contract value threshold.
Contract is suitable for SMEs?
Yes
Contract is suitable for VCSEs?
No
Description
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology, we require a digital microscope to perform measurement and imaging of semiconductor-die, packages at various stages of assembly, modules and populated/unpopulated printed circuit boards (PCBs).
The measurement system shall allow the CSA Catapult to perform in-house 3D geometrical measurement throughout the packaging and electronics assembly process. The equipment is intended to facilitate first article inspection, provide a quantitative description of component and assembly geometry, providing analysis and validation steps. The system shall also be capable of creating exportable 3D surfaces from measured parts,rapid analysis, and measurement generation suited to evaluating whole assemblies quickly. Further typical measurements would include bonded die, die surfaces, positional information on placed and soldered components, wire bonds, both loop height and foot geometry. The system will be applied to all package and module architectures within the Photonics, Power Electronics and RF modules, and further to a range of custom small components.
The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by January 2021.
More information
Additional text
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To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-043 in the subject field.
About the buyer
Address
CSA Catapult Innovation Centre
Celtic Way Imperial Park
Newport
NP10 8BE
Wales
procurement@csa.catapult.org.uk
Website
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Closing: 3 December 2020, 12pm
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