Published date: 27 September 2023

Closed opportunity - This means that the contract is currently closed. The buying department may be considering suppliers that have already applied, or no suitable offers were made.


Closing: 2 November 2023, 2pm

Contract summary

Industry

  • Indium - 14763000

Location of contract

South East

Value of contract

£320,000

Procurement reference

BIP811761614

Published date

27 September 2023

Closing date

2 November 2023

Closing time

2pm

Contract start date

4 December 2023

Contract end date

3 December 2024

Contract type

Supply contract

Procedure type

Open procedure

Any interested supplier may submit a tender in response to an opportunity notice.

Contract is suitable for SMEs?

Yes

Contract is suitable for VCSEs?

No

Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

More information

Links

About the buyer

Address

https://www.ukri.org
North Star Avenue
Swindon
SN2 1FL
UK

Telephone

+441793442000

Email

commercial@ukri.org