Published date: 11 November 2020

Closed opportunity - This means that the contract is currently closed. The buying department may be considering suppliers that have already applied, or no suitable offers were made.


Closing: 25 November 2020, 12pm

Contract summary

Industry

  • Electrical equipment and apparatus - 31600000

  • Laboratory, optical and precision equipments (excl. glasses) - 38000000

Location of contract

Wales

Value of contract

£40,000 to £60,000

Procurement reference

ICT-2020-040

Published date

11 November 2020

Closing date

25 November 2020

Closing time

12pm

Contract start date

18 December 2020

Contract end date

17 December 2023

Contract type

Supply contract

Procedure type

Open procedure (below threshold)

Any interested supplier may submit a tender in response to an opportunity notice.

This procedure can be used for procurements below the relevant contract value threshold.

Contract is suitable for SMEs?

Yes

Contract is suitable for VCSEs?

No


Description

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.

As part of the package assembly research and development methodology we are looking to increase our capacity with wire bonding. We currently have a Hesse BJ653 with five bondheads to provide the capability to bond in a variety of applications. This includes fine wire bonding - ball-wedge, wedge-wedge and stud bumping using gold and aluminium wires. There are heavy wire and ribbon capabilities too with aluminium and copper bondwire. While the flexibility of this platform is inline with our current and future requirements it has also become a bottle neck as a number of CR&D projects and commercial activities require access to the system.

The Compound Semiconductor Applications Catapult intends to purchase a semi-automatic wire bonder for use at the Advanced Packaging Laboratory at the Innovation Centre in Newport. This will increase capacity and provide additional flexibility to our scheduling for project and commercial activities.

The estimated budget range for the contract is £40,000 - £60,000. This is the estimated maximum value covering related future services and options.

The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by January 2021.


More information

Additional text

To express interest in this opportunity and receive the procurement documents, please email procurement@csa.catapult.org.uk with the reference ICT-2020-040 in the subject field.


About the buyer

Address

CSA Catapult Innovation Centre
Celtic Way Imperial Park
Newport
NP10 8BE
Wales

Email

procurement@csa.catapult.org.uk

Website

https://csa.catapult.org.uk